| 11856878 |
High-density resistive random-access memory array with self-aligned bottom electrode contact |
Dexin Kong, Ekmini Anuja De Silva, Daniel Schmidt |
2023-12-26 |
| 11849647 |
Nonmetallic liner around a magnetic tunnel junction |
Tao Li, Yann Mignot, Tsung-Sheng Kang, Wenyu Xu |
2023-12-19 |
| 11830807 |
Placing top vias at line ends by selective growth of via mask from line cut dielectric |
Ekmini Anuja De Silva, Dominik Metzler, John C. Arnold |
2023-11-28 |
| 11812668 |
Pillar-based memory hardmask smoothing and stress reduction |
Michael Rizzolo, Theodorus E. Standaert, Dominik Metzler |
2023-11-07 |
| 11778929 |
Selective encapsulation for metal electrodes of embedded memory devices |
Ekmini Anuja De Silva, Jennifer Church |
2023-10-03 |
| 11751492 |
Embedded memory pillar |
Dexin Kong, Ekmini Anuja De Silva, Daniel Schmidt |
2023-09-05 |
| 11744083 |
Fabrication of embedded memory devices utilizing a self assembled monolayer |
Ekmini Anuja De Silva, Chih-Chao Yang |
2023-08-29 |
| 11699592 |
Inverse tone pillar printing method using organic planarizing layer pillars |
Nelson Felix, Ekmini Anuja De Silva, Praveen Joseph |
2023-07-11 |
| 11682558 |
Fabrication of back-end-of-line interconnects |
Chi-Chun Liu, Nelson Felix, Ekmini Anuja De Silva |
2023-06-20 |
| 11681213 |
EUV pattern transfer using graded hardmask |
Nelson Felix, Luciana Meli Thompson, Ekmini Anuja De Silva |
2023-06-20 |
| 11621294 |
Embedding MRAM device in advanced interconnects |
Saumya Sharma, Tianji Zhou, Chih-Chao Yang |
2023-04-04 |
