Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756786 | Forming high carbon content flowable dielectric film with low processing damage | Benjamin D. Briggs, Donald F. Canaperi, Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha +2 more | 2023-09-12 |