Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791398 | Nano multilayer carbon-rich low-k spacer | Donald F. Canaperi, Richard A. Conti, Eric R. Miller, Son V. Nguyen | 2023-10-17 |
| 11756786 | Forming high carbon content flowable dielectric film with low processing damage | Benjamin D. Briggs, Donald F. Canaperi, Huy Cao, Son V. Nguyen, Hosadurga Shobha +2 more | 2023-09-12 |
| 11658062 | Air gap spacer formation for nano-scale semiconductor devices | Kangguo Cheng, Juntao Li, Eric G. Liniger, Sanjay C. Mehta, Son V. Nguyen +2 more | 2023-05-23 |