| 11837623 |
Integrated circuit having vertical routing to bond pads |
Christian Boemler, Justin Gordon Adams Wehner, Drew Fairbanks, Sean P. Kilcoyne |
2023-12-05 |
| 11791398 |
Nano multilayer carbon-rich low-k spacer |
Donald F. Canaperi, Richard A. Conti, Thomas J. Haigh, Jr., Son V. Nguyen |
2023-10-17 |
| 11753736 |
Indium electroplating on physical vapor deposition tantalum |
Michael J. Rondon, Jon Sigurdson |
2023-09-12 |
| 11710768 |
Hybrid diffusion break with EUV gate patterning |
Indira Seshadri, Andrew M. Greene, Julien Frougier, Veeraraghavan S. Basker |
2023-07-25 |
| 11710756 |
Integrating optical elements with electro-optical sensors via direct-bond hybridization |
Jamal I. Mustafa, Robert C. Anderson, John L. Vampola, Sean P. Kilcoyne, George Grama |
2023-07-25 |
| 11695059 |
Bottom source/drain etch with fin-cut-last-VTFET |
Tao Li, Indira Seshadri, Nelson Felix |
2023-07-04 |
| 11673766 |
Elevator analytics facilitating passenger destination prediction and resource optimization |
Gauri Karve, Tara Astigarraga, Kangguo Cheng, Fee Li Lie, Sean Teehan +1 more |
2023-06-13 |
| 11652161 |
Nanosheet channel-to-source and drain isolation |
Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan |
2023-05-16 |
| 11646358 |
Sacrificial fin for contact self-alignment |
Yann Mignot, Indira Seshadri, Su Chen Fan, Christopher J. Waskiewicz |
2023-05-09 |
| 11646235 |
Vertical tunneling field effect transistor with dual liner bottom spacer |
Marc A. Bergendahl, Kangguo Cheng, Sean Teehan, John R. Sporre |
2023-05-09 |
| 11615992 |
Substrate isolated VTFET devices |
Marc A. Bergendahl, Kangguo Cheng, John R. Sporre, Gauri Karve, Fee Li Lie |
2023-03-28 |
| 11605717 |
Wrapped-around contact for vertical field effect transistor top source-drain |
Ruilong Xie, Jeffrey C. Shearer, Su Chen Fan, Heng Wu |
2023-03-14 |
| 11557589 |
Air gap spacer for metal gates |
Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, John R. Sporre, Sean Teehan |
2023-01-17 |
