Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837501 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2023-12-05 |
| 11721578 | Split ash processes for via formation to suppress damage to low-K layers | Yen-Tien Lu, Angelique Raley | 2023-08-08 |
| 11710658 | Structure and method to improve FAV RIE process margin and Electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2023-07-25 |