Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837471 | Methods of patterning small features | Katie Lutker-Lee, Jake Kaminsky, Yu-Hao Tsai, Mingmei Wang | 2023-12-05 |
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Xinghua Sun, Shihsheng Chang, Eric Chih-Fang Liu, Katie Lutker-Lee | 2023-09-12 |
| 11742241 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Yen-Tien Lu, David L. O'Meara, Jeffrey Smith | 2023-08-29 |
| 11721578 | Split ash processes for via formation to suppress damage to low-K layers | Yen-Tien Lu, Joe Lee | 2023-08-08 |
| 11688604 | Method for using ultra thin ruthenium metal hard mask for etching profile control | Yen-Tien Lu, Kai-Hung Yu | 2023-06-27 |
| 11658038 | Method for dry etching silicon carbide films for resist underlayer applications | Christopher Cole, Qiaowei Lou | 2023-05-23 |
| 11621164 | Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposes | Katie Lutker-Lee, David L. O'Meara | 2023-04-04 |