Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Xinghua Sun, Eric Chih-Fang Liu, Angelique Raley, Katie Lutker-Lee | 2023-09-12 |
| 11651967 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | David L. O'Meara, Andrew Metz, Yun Han | 2023-05-16 |