Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Shihsheng Chang, Eric Chih-Fang Liu, Angelique Raley, Katie Lutker-Lee | 2023-09-12 |
| 11742241 | ALD (atomic layer deposition) liner for via profile control and related applications | Yen-Tien Lu, Angelique Raley, David L. O'Meara, Jeffrey Smith | 2023-08-29 |