Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756790 | Method for patterning a dielectric layer | Xinghua Sun, Shihsheng Chang, Eric Chih-Fang Liu, Angelique Raley, Katie Lutker-Lee | 2023-09-12 |
| 11742241 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Angelique Raley, David L. O'Meara, Jeffrey Smith | 2023-08-29 |
| 11721578 | Split ash processes for via formation to suppress damage to low-K layers | Angelique Raley, Joe Lee | 2023-08-08 |
| 11688604 | Method for using ultra thin ruthenium metal hard mask for etching profile control | Kai-Hung Yu, Angelique Raley | 2023-06-27 |