Issued Patents 2022
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao, Po-Han Wang | 2022-05-24 |
| 11335579 | Method for manufacturing a semiconductor package and method for testing bonding strength of composite specimen | Chih-Yu Wang, Hui-Jung Tsai | 2022-05-17 |
| 11322450 | Chip package and method of forming the same | Yu-Hsiang Hu, Chen-Hua Yu | 2022-05-03 |
| 11322479 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Chen-Cheng Kuo | 2022-05-03 |
| 11322360 | Method of manufacturing semiconductor structure | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2022-05-03 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2022-03-29 |
| 11289426 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Jhih-Yu Wang, Yu-Hsiang Hu | 2022-03-29 |
| 11289410 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Ming-Che Ho, Tzung-Hui Lee | 2022-03-29 |
| 11282804 | Package structure and method of manufacturing the same | Wei-Chih Chen, Yu-Hsiang Hu, Sih-Hao Liao | 2022-03-22 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu | 2022-03-15 |
| 11270927 | Package structure and method of forming the same | Hung-Chun Cho, Yu-Hsiang Hu, Sih-Hao Liao, Wei-Chih Chen | 2022-03-08 |
| 11251121 | Package structure and method of fabricating the same | Hui-Jung Tsai, Jyun-Siang Peng | 2022-02-15 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-02-15 |
| 11239233 | Integrated circuit packages and methods of forming same | Yi-Wen Wu, Ming-Che Ho | 2022-02-01 |
| 11232971 | Workpiece holding mechanism, process system and manufacturing method of semiconductor structure | Hui-Jung Tsai, Keng-Han Lin | 2022-01-25 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu | 2022-01-18 |
| 11215929 | Photoresist system and method | De-Yuan Lu, Chen-Hua Yu, Ming-Tan Lee | 2022-01-04 |
| 11217518 | Package structure and method of forming the same | Tzung-Hui Lee, Ming-Che Ho | 2022-01-04 |
| 11214668 | Resin composition for resin composite, resin composite, and refrigeration device comprising the said resin composite | Jui-Hsi Hsu, Chen-Pao Huang | 2022-01-04 |