Issued Patents 2020
Showing 51–61 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622240 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang +1 more | 2020-03-24 |
| 10586724 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Hung-Jui Kou, Ming-Da Cheng | 2020-03-10 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2020-02-11 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2020-02-04 |
| 10534353 | System and method to reduce pre-back-grinding process defects | Chen-Fa Lu, Cheng-Ting Chen, James Hu | 2020-01-14 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2020-01-14 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10535616 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng | 2020-01-14 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2020-01-14 |