Issued Patents 2017
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646943 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2017-05-09 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Mirng-Ji Lii | 2017-05-09 |
| 9640521 | Multi-die package with bridge layer and method for making the same | Wei Sen Chang, Yu-Feng Chen, Mirng-Ji Lii | 2017-05-02 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Yu-Feng Chen, Sheng-Yu Wu | 2017-04-25 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Han-Ping Pu | 2017-04-11 |
| 9613917 | Package-on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2017-04-04 |
| 9607959 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Yu-Feng Chen | 2017-03-28 |
| 9607936 | Copper bump joint structures with improved crack resistance | Ching-Wen Hsiao, Jiun Yi Wu, Ru-Ying Huang | 2017-03-28 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Feng Chen | 2017-03-07 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chang-Chia Huang, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-02-28 |
| 9576821 | Package structures including a capacitor and methods of forming the same | Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen | 2017-02-21 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Yu-Feng Chen, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-01-31 |
| 9543278 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2017-01-10 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Chen-Hua Yu, Mirng-Ji Lii, Yu-Jen Tseng | 2017-01-03 |