| 9847234 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
Robert L. Sankman |
2017-12-19 |
| 9842832 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more |
2017-12-12 |
| 9832860 |
Panel level fabrication of package substrates with integrated stiffeners |
Robert Starkston, Patrick Nardi, Keith Jones, Javier Soto Gonzalez |
2017-11-28 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, Ravi Mahajan +8 more |
2017-11-14 |
| 9780054 |
Semiconductor package with embedded die and its methods of fabrication |
Javier Soto Gonzalez, Nicholas R. Watts, Ravi Kiran Nalla |
2017-10-03 |
| 9713255 |
Electro-magnetic interference (EMI) shielding techniques and configurations |
Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande |
2017-07-18 |
| 9691711 |
Method of making an electromagnetic interference shield for semiconductor chip packages |
Ravindranath V. Mahajan, Adel A. Elsherbini, Nitin A. Deshpande |
2017-06-27 |
| 9691728 |
BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility |
Robert M. Nickerson, Min Tao |
2017-06-27 |
| 9686870 |
Method of forming a microelectronic device package |
Weng Hong Teh |
2017-06-20 |
| 9679843 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan |
2017-06-13 |
| 9646851 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
Robert L. Sankman |
2017-05-09 |
| 9642248 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov |
2017-05-02 |
| 9576909 |
Bumpless die-package interface for bumpless build-up layer (BBUL) |
Weng Hong Teh, Robert L. Sankman |
2017-02-21 |
| 9572258 |
Method of forming a substrate core with embedded capacitor and structures formed thereby |
Sriram Srinivasan, Cengiz A. Palanduz, Victor Prokofiev, Joel Auernheimer |
2017-02-14 |
| 9553075 |
Recessed and embedded die coreless package |
— |
2017-01-24 |