Issued Patents 2017
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847234 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2017-12-19 |
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2017-12-12 |
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | Robert Starkston, Patrick Nardi, Keith Jones, Javier Soto Gonzalez | 2017-11-28 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, Ravi Mahajan +8 more | 2017-11-14 |
| 9780054 | Semiconductor package with embedded die and its methods of fabrication | Javier Soto Gonzalez, Nicholas R. Watts, Ravi Kiran Nalla | 2017-10-03 |
| 9713255 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande | 2017-07-18 |
| 9691711 | Method of making an electromagnetic interference shield for semiconductor chip packages | Ravindranath V. Mahajan, Adel A. Elsherbini, Nitin A. Deshpande | 2017-06-27 |
| 9691728 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Robert M. Nickerson, Min Tao | 2017-06-27 |
| 9686870 | Method of forming a microelectronic device package | Weng Hong Teh | 2017-06-20 |
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 |
| 9646851 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2017-05-09 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |
| 9576909 | Bumpless die-package interface for bumpless build-up layer (BBUL) | Weng Hong Teh, Robert L. Sankman | 2017-02-21 |
| 9572258 | Method of forming a substrate core with embedded capacitor and structures formed thereby | Sriram Srinivasan, Cengiz A. Palanduz, Victor Prokofiev, Joel Auernheimer | 2017-02-14 |
| 9553075 | Recessed and embedded die coreless package | — | 2017-01-24 |