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John S. Guzek — 15 Patents in 2017

Intel: 15 patents #82 of 5,604Top 2%

Chandler, AZ: #6 of 597 inventorsTop 2%

Arizona: #33 of 3,883 inventorsTop 1%

Overall (2017): #3,020 of 506,227Top 1%

15 Patents 2017

Issued Patents 2017

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9847234	Embedded semiconductive chips in reconstituted wafers, and systems containing same	Robert L. Sankman	2017-12-19	$19,551,000
9842832	High density interconnection of microelectronic devices	Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more	2017-12-12	$18,742,000
9832860	Panel level fabrication of package substrates with integrated stiffeners	Robert Starkston, Patrick Nardi, Keith Jones, Javier Soto Gonzalez	2017-11-28	$12,678,000
9820384	Flexible electronic assembly method	Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, Ravi Mahajan +8 more	2017-11-14	$11,178,000
9780054	Semiconductor package with embedded die and its methods of fabrication	Javier Soto Gonzalez, Nicholas R. Watts, Ravi Kiran Nalla	2017-10-03	$11,313,000
9713255	Electro-magnetic interference (EMI) shielding techniques and configurations	Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande	2017-07-18	$6,909,000
9691711	Method of making an electromagnetic interference shield for semiconductor chip packages	Ravindranath V. Mahajan, Adel A. Elsherbini, Nitin A. Deshpande	2017-06-27	$7,334,000
9691728	BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility	Robert M. Nickerson, Min Tao	2017-06-27	$7,334,000
9686870	Method of forming a microelectronic device package	Weng Hong Teh	2017-06-20	$9,273,000
9679843	Localized high density substrate routing	Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan	2017-06-13	$8,497,000
9646851	Embedded semiconductive chips in reconstituted wafers, and systems containing same	Robert L. Sankman	2017-05-09	$10,144,000
9642248	Microelectronic structures having laminated or embedded glass routing structures for high density packaging	Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov	2017-05-02	$12,076,000
9576909	Bumpless die-package interface for bumpless build-up layer (BBUL)	Weng Hong Teh, Robert L. Sankman	2017-02-21	$10,078,000
9572258	Method of forming a substrate core with embedded capacitor and structures formed thereby	Sriram Srinivasan, Cengiz A. Palanduz, Victor Prokofiev, Joel Auernheimer	2017-02-14	$9,787,000
9553075	Recessed and embedded die coreless package	—	2017-01-24	$12,666,000