| 9853359 |
Antenna integrated in a package substrate |
Telesphor Kamgaing |
2017-12-26 |
| 9832863 |
Method of fabricating a stretchable computing device |
Aleksandar Aleksov, Shawna M. Liff |
2017-11-28 |
| 9824962 |
Local dense patch for board assembly utilizing laser structuring metallization process |
Fay Hua |
2017-11-21 |
| 9824901 |
Complex cavity formation in molded packaging structures |
Sasha N. Oster, Joshua D. Heppner, Shawna M. Liff |
2017-11-21 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more |
2017-11-14 |
| 9807866 |
Shielding mold for electric and magnetic EMI mitigation |
Zhichao Zhang, Robert L. Sankman, Kemal Aygun |
2017-10-31 |
| 9788581 |
Textile that includes an electronic system |
Aleksandar Aleksov, Sasha N. Oster, Braxton Lathrop, Nadine L. Dabby, Feras Eid |
2017-10-17 |
| 9795026 |
Electronic package that includes finned vias |
Nayandeep K. Mahanta, Joshua D. Heppner |
2017-10-17 |
| 9773742 |
Embedded millimeter-wave phased array module |
Telesphor Kamgaing, Valluri Rao |
2017-09-26 |
| 9735893 |
Patch system for in-situ therapeutic treatment |
Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Johanna M. Swan, Amit S. Baxi +3 more |
2017-08-15 |
| 9711428 |
Dual-sided die packages |
Henning Braunisch, Feras Eid, Johanna M. Swan, Don Nelson |
2017-07-18 |
| 9713255 |
Electro-magnetic interference (EMI) shielding techniques and configurations |
Ravindranath V. Mahajan, John S. Guzek, Nitin A. Deshpande |
2017-07-18 |
| 9691711 |
Method of making an electromagnetic interference shield for semiconductor chip packages |
Ravindranath V. Mahajan, John S. Guzek, Nitin A. Deshpande |
2017-06-27 |
| 9659904 |
Distributed on-package millimeter-wave radio |
Telesphor Kamgaing |
2017-05-23 |
| 9647636 |
Piezoelectric package-integrated delay lines for radio frequency identification tags |
Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more |
2017-05-09 |
| 9635764 |
Integrated circuit and method that utilize a shape memory material |
Shipeng Qiu, Shawna M. Liff, Kayleen L. E. Helms, Joshua D. Heppner, Johanna M. Swan +1 more |
2017-04-25 |