| 9842832 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, William J. Lambert +6 more |
2017-12-12 |
| 9795038 |
Electronic package design that facilitates shipping the electronic package |
Omkar G. Karhade, Nachiket R. Raravikar |
2017-10-17 |
| 9754890 |
Embedded multi-device bridge with through-bridge conductive via signal connection |
Omkar G. Karhade |
2017-09-05 |
| 9741692 |
Methods to form high density through-mold interconnections |
Omkar G. Karhade, Edvin Cetegen, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh |
2017-08-22 |
| 9716067 |
Integrated circuit package with embedded bridge |
Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Shawna M. Liff |
2017-07-25 |
| 9713255 |
Electro-magnetic interference (EMI) shielding techniques and configurations |
Adel A. Elsherbini, Ravindranath V. Mahajan, John S. Guzek |
2017-07-18 |
| 9691711 |
Method of making an electromagnetic interference shield for semiconductor chip packages |
Ravindranath V. Mahajan, John S. Guzek, Adel A. Elsherbini |
2017-06-27 |
| 9685421 |
Methods for high precision microelectronic die integration |
Aleksandar Aleksov, Ravindranath V. Mahajan, Omkar G. Karhade |
2017-06-20 |
| 9685388 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa |
2017-06-20 |
| 9659899 |
Die warpage control for thin die assembly |
Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li +2 more |
2017-05-23 |
| 9607964 |
Method and materials for warpage thermal and interconnect solutions |
Omkar G. Karhade, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li |
2017-03-28 |
| 9583470 |
Electronic device with solder pads including projections |
Omkar G. Karhade |
2017-02-28 |
| 9576942 |
Integrated circuit assembly that includes stacked dice |
Omkar G. Karhade, Bassam M. Ziadeh, Yoshihiro Tomita |
2017-02-21 |