Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9844133 | Flexible substrate including stretchable sheet | Koichi Hirano, Susumu Sawada, Koji Kawakita, Takashi Ichiryu, Masanori Nomura | 2017-12-12 |
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yosuke Kanaoka | 2017-10-17 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9678272 | Flexible optical substrate | Susumu Sawada | 2017-06-13 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh | 2017-02-21 |
| 9543197 | Package with dielectric or anisotropic conductive (ACF) buildup layer | Chuan Hu, Dingying Xu | 2017-01-10 |