Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9793151 | Stiffener tape for electronic assembly | Xavier Francois Brun, Arjun Krishnan, Mohit Mamodia | 2017-10-17 | $9,876,000 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Xavier Francois Brun, Edward R. Prack, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 | $7,972,000 |
| 9543197 | Package with dielectric or anisotropic conductive (ACF) buildup layer | Chuan Hu, Yoshihiro Tomita | 2017-01-10 | $11,357,000 |