Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824991 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad | 2017-11-21 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Danish Faruqui, Tyler N. Osborn +2 more | 2017-10-10 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Xavier Francois Brun, Dingying Xu, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9583390 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad | 2017-02-28 |