Edward R. Prack — 6 Patents at Intel

Issued Patents 2017

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9824991	Organic thin film passivation of metal interconnections	Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad	2017-11-21	$11,290,000
9786517	Ablation method and recipe for wafer level underfill material patterning and removal	Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Danish Faruqui, Tyler N. Osborn +2 more	2017-10-10	$9,084,000
9659889	Solder-on-die using water-soluble resist system and method	Mihir A. Oka, Xavier Francois Brun, Dingying Xu, Kabirkumar Mirpuri, Saikumar Jayaraman	2017-05-23	$7,972,000
9613933	Package structure to enhance yield of TMI interconnections	Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more	2017-04-04	$8,141,000
9613934	Interconnect structures with polymer core	Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson	2017-04-04	$8,141,000
9583390	Organic thin film passivation of metal interconnections	Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Mark S. Hlad	2017-02-28	$9,011,000