Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Amruthavalli Pallavi Alur, Ram Viswanath, Wei-Lun Kane Jen | 2017-03-21 |