Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Robert Alan May, Sri Ranga Sai Boyapati, Daniel N. Sobieski | 2017-09-12 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Sairam Agraharam, Ram Viswanath, Wei-Lun Kane Jen | 2017-03-21 |