Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820386 | Plasma etching of solder resist openings | Kristof Darmawikarta, Rahul Jain, Robert Alan May, Sheng Li | 2017-11-14 |
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Robert Alan May, Amruthavalli Pallavi Alur, Daniel N. Sobieski | 2017-09-12 |
| 9741606 | Desmear with metalized protective film | Zheng Zhou, Amanda E. Schuckman | 2017-08-22 |
| 9735120 | Low z-height package assembly | Qinglei Zhang | 2017-08-15 |