Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9842800 | Forming interconnect structures utilizing subtractive paterning techniques | — | 2017-12-12 | $18,742,000 |
| 9820386 | Plasma etching of solder resist openings | Kristof Darmawikarta, Rahul Jain, Sheng Li, Sri Ranga Sai Boyapati | 2017-11-14 | $11,178,000 |
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur, Daniel N. Sobieski | 2017-09-12 | $10,213,000 |
| 9728500 | Integrated circuit surface layer with adhesion-functional group | Siddharth K. Alur, Sri Chaitra Jyotsna Chavali, Whitney Bryks | 2017-08-08 | $11,912,000 |