Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799593 | Semiconductor package substrate having an interfacial layer | Bainye Francoise ANGOUA, Dilan Seneviratne | 2017-10-24 |
| 9728500 | Integrated circuit surface layer with adhesion-functional group | Siddharth K. Alur, Sri Chaitra Jyotsna Chavali, Robert Alan May | 2017-08-08 |