Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799593 | Semiconductor package substrate having an interfacial layer | Whitney Bryks, Bainye Francoise ANGOUA | 2017-10-24 |
| 9788416 | Multilayer substrate for semiconductor packaging | Wei-Lun Kane Jen, Padam Jain, Chi-Mon Chen | 2017-10-10 |
| 9646854 | Embedded circuit patterning feature selective electroless copper plating | Yonggang Li, Aritra Dhar, Jon M. Williams | 2017-05-09 |
| 9554468 | Panel with releasable core | Ching-Ping Janet Shen, Charan Gurumurthy, Ravi Shankar, Liwen Jin, Deepak Arora | 2017-01-24 |
| 9554472 | Panel with releasable core | Ching-Ping Janet Shen, Ravi Shankar, Yonggang Li, Charan Gurumurthy | 2017-01-24 |