Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820390 | Process for forming a semiconductor device substrate | Mihir K. Roy, Islam A. Salama | 2017-11-14 |
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Rahul N. Manepalli, Javier Soto Gonzalez | 2017-07-25 |
| 9646854 | Embedded circuit patterning feature selective electroless copper plating | Aritra Dhar, Dilan Seneviratne, Jon M. Williams | 2017-05-09 |
| 9648733 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2017-05-09 |
| 9554472 | Panel with releasable core | Ching-Ping Janet Shen, Ravi Shankar, Dilan Seneviratne, Charan Gurumurthy | 2017-01-24 |