Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Javier Soto Gonzalez | 2017-07-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Javier Soto Gonzalez | 2017-07-25 |