Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721906 | Electronic package with corner supports | Manish Dubey, Rajendra C. Dias, Baris Bicen, Bharat P. Penmecha | 2017-08-01 |
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Yonggang Li, Rahul N. Manepalli, Javier Soto Gonzalez | 2017-07-25 |