Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Rahul N. Manepalli | 2017-07-25 |
| 9559088 | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same | Houssam Jomaa | 2017-01-31 |