Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679841 | Substrate and method of forming the same | Omar J. Bchir, Kuiwon Kang, Chin-Kwan Kim | 2017-06-13 |
| 9609751 | Package substrate comprising surface interconnect and cavity comprising electroless fill | Omar J. Bchir, Chin-Kwan Kim | 2017-03-28 |
| 9559088 | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same | Javier Soto Gonzalez | 2017-01-31 |
| 9536805 | Power management integrated circuit (PMIC) integration into a processor package | Siamak Fazelpour, Jiantao Zheng, Mario Francisco Velez, Sun Hyuck Yun, Rajneesh Kumar | 2017-01-03 |