Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9813043 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Changhan Hobie Yun +5 more | 2017-11-07 |
| 9807882 | Density-optimized module-level inductor ground structure | David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Chengjie Zuo, Jonghae Kim | 2017-10-31 |
| 9780048 | Side-assembled passive devices | David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Shiqun Gu +1 more | 2017-10-03 |
| 9773862 | High quality factor capacitors and methods for fabricating high quality factor capacitors | Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Donald William Kidwell, Jr. +4 more | 2017-09-26 |
| 9691694 | Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate | Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Xiaonan Zhang | 2017-06-27 |
| 9692386 | Three-dimensional wire bond inductor | Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Changhan Hobie Yun | 2017-06-27 |
| 9666362 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Robert Paul Mikulka +1 more | 2017-05-30 |
| 9660110 | Varactor device with backside contact | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun +3 more | 2017-05-23 |
| 9634645 | Integration of a replica circuit and a transformer above a dielectric substrate | Je-Hsiung Lan, Chi Shun Lo, Jonghae Kim, John H. Hong | 2017-04-25 |
| 9634640 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Changhan Hobie Yun +5 more | 2017-04-25 |
| 9620463 | Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) | Daeik Daniel Kim, David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +1 more | 2017-04-11 |
| 9560745 | Devices and methods to reduce stress in an electronic device | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +1 more | 2017-01-31 |
| 9548350 | High quality factor capacitors and methods for fabricating high quality factor capacitors | Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Donald William Kidwell, Jr. +4 more | 2017-01-17 |
| 9536805 | Power management integrated circuit (PMIC) integration into a processor package | Siamak Fazelpour, Jiantao Zheng, Sun Hyuck Yun, Rajneesh Kumar, Houssam Jomaa | 2017-01-03 |