Issued Patents 2017
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837209 | Capacitor structure for wideband resonance suppression in power delivery networks | Kyu-Pyung Hwang, Young Kyu Song, Dong Wook Kim | 2017-12-05 |
| 9813043 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-11-07 |
| 9807882 | Density-optimized module-level inductor ground structure | David Francis Berdy, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim | 2017-10-31 |
| 9780048 | Side-assembled passive devices | David Francis Berdy, Chengjie Zuo, Niranjan Sunil Mudakatte, Mario Francisco Velez, Shiqun Gu +1 more | 2017-10-03 |
| 9773862 | High quality factor capacitors and methods for fabricating high quality factor capacitors | Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more | 2017-09-26 |
| 9768109 | Integrated circuits (ICS) on a glass substrate | Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Je-Hsiung Lan +1 more | 2017-09-19 |
| 9721946 | Backside coupled symmetric varactor structure | Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan, Jonghae Kim | 2017-08-01 |
| 9692386 | Three-dimensional wire bond inductor | Chengjie Zuo, Mario Francisco Velez, Jonghae Kim, Daeik Daniel Kim | 2017-06-27 |
| 9673275 | Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits | Daeik Daniel Kim, Je-Hsiung Lan, Niranjan Sunil Mudakatte, Jonghae Kim, Matthew Michael Nowak | 2017-06-06 |
| 9666362 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Mario Francisco Velez, Robert Paul Mikulka +1 more | 2017-05-30 |
| 9660110 | Varactor device with backside contact | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Mario Francisco Velez +3 more | 2017-05-23 |
| 9634640 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-04-25 |
| 9620463 | Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) | Daeik Daniel Kim, David Francis Berdy, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +1 more | 2017-04-11 |
| 9560745 | Devices and methods to reduce stress in an electronic device | Daeik Daniel Kim, Je-Hsiung Lan, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +1 more | 2017-01-31 |
| 9548350 | High quality factor capacitors and methods for fabricating high quality factor capacitors | Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more | 2017-01-17 |