Issued Patents 2017
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9813043 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Mario Francisco Velez, Changhan Hobie Yun +5 more | 2017-11-07 |
| 9807882 | Density-optimized module-level inductor ground structure | David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo | 2017-10-31 |
| 9806144 | Solenoid inductor in a substrate | Daeik Daniel Kim, Young Kyu Song, Xiaonan Zhang | 2017-10-31 |
| 9780048 | Side-assembled passive devices | David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more | 2017-10-03 |
| 9773862 | High quality factor capacitors and methods for fabricating high quality factor capacitors | Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more | 2017-09-26 |
| 9768109 | Integrated circuits (ICS) on a glass substrate | Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2017-09-19 |
| 9721946 | Backside coupled symmetric varactor structure | Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan, Changhan Hobie Yun | 2017-08-01 |
| 9692386 | Three-dimensional wire bond inductor | Chengjie Zuo, Mario Francisco Velez, Daeik Daniel Kim, Changhan Hobie Yun | 2017-06-27 |
| 9684335 | Rotary device and electronic device having the same | Youngsun Park | 2017-06-20 |
| 9673275 | Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits | Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan, Niranjan Sunil Mudakatte, Matthew Michael Nowak | 2017-06-06 |
| 9666362 | Superposed structure 3D orthogonal through substrate inductor | David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez +1 more | 2017-05-30 |
| 9660110 | Varactor device with backside contact | Daeik Daniel Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun, Mario Francisco Velez +3 more | 2017-05-23 |
| 9634645 | Integration of a replica circuit and a transformer above a dielectric substrate | Je-Hsiung Lan, Chi Shun Lo, Mario Francisco Velez, John H. Hong | 2017-04-25 |
| 9634640 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Mario Francisco Velez, Changhan Hobie Yun +5 more | 2017-04-25 |
| 9620463 | Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) | Daeik Daniel Kim, David Francis Berdy, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo +1 more | 2017-04-11 |
| 9601607 | Dual mode transistor | Xia Li, Daeik Daniel Kim, Bin Yang, Daniel Wayne Perry | 2017-03-21 |
| 9560745 | Devices and methods to reduce stress in an electronic device | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +1 more | 2017-01-31 |
| 9557771 | Electronic device including flexible display | Jihoon Park, Chungkeun Yoo, Youngsun Park | 2017-01-31 |
| 9552262 | Method, system and program product for deploying and allocating an autonomic sensor network ecosystem | Riz Amanuddin, Moon J. Kim, Eric C. Yee | 2017-01-24 |
| 9548350 | High quality factor capacitors and methods for fabricating high quality factor capacitors | Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more | 2017-01-17 |