| 9813043 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Mario Francisco Velez, Changhan Hobie Yun +5 more |
2017-11-07 |
$11,520,000 |
| 9807882 |
Density-optimized module-level inductor ground structure |
David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo |
2017-10-31 |
$7,754,000 |
| 9806144 |
Solenoid inductor in a substrate |
Daeik Daniel Kim, Young Kyu Song, Xiaonan Zhang |
2017-10-31 |
$7,754,000 |
| 9780048 |
Side-assembled passive devices |
David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more |
2017-10-03 |
$6,947,000 |
| 9773862 |
High quality factor capacitors and methods for fabricating high quality factor capacitors |
Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more |
2017-09-26 |
$12,443,000 |
| 9768109 |
Integrated circuits (ICS) on a glass substrate |
Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Changhan Hobie Yun, Je-Hsiung Lan +1 more |
2017-09-19 |
$13,033,000 |
| 9721946 |
Backside coupled symmetric varactor structure |
Daeik Daniel Kim, David Francis Berdy, Je-Hsiung Lan, Changhan Hobie Yun |
2017-08-01 |
$7,518,000 |
| 9692386 |
Three-dimensional wire bond inductor |
Chengjie Zuo, Mario Francisco Velez, Daeik Daniel Kim, Changhan Hobie Yun |
2017-06-27 |
$10,438,000 |
| 9684335 |
Rotary device and electronic device having the same |
Youngsun Park |
2017-06-20 |
|
| 9673275 |
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits |
Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Lan, Niranjan Sunil Mudakatte, Matthew Michael Nowak |
2017-06-06 |
$5,960,000 |
| 9666362 |
Superposed structure 3D orthogonal through substrate inductor |
David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez +1 more |
2017-05-30 |
$7,952,000 |
| 9660110 |
Varactor device with backside contact |
Daeik Daniel Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun, Mario Francisco Velez +3 more |
2017-05-23 |
$10,004,000 |
| 9634645 |
Integration of a replica circuit and a transformer above a dielectric substrate |
Je-Hsiung Lan, Chi Shun Lo, Mario Francisco Velez, John H. Hong |
2017-04-25 |
$8,459,000 |
| 9634640 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Mario Francisco Velez, Changhan Hobie Yun +5 more |
2017-04-25 |
$8,459,000 |
| 9620463 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) |
Daeik Daniel Kim, David Francis Berdy, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo +1 more |
2017-04-11 |
$7,135,000 |
| 9601607 |
Dual mode transistor |
Xia Li, Daeik Daniel Kim, Bin Yang, Daniel Wayne Perry |
2017-03-21 |
$7,882,000 |
| 9560745 |
Devices and methods to reduce stress in an electronic device |
Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +1 more |
2017-01-31 |
$8,983,000 |
| 9557771 |
Electronic device including flexible display |
Jihoon Park, Chungkeun Yoo, Youngsun Park |
2017-01-31 |
|
| 9552262 |
Method, system and program product for deploying and allocating an autonomic sensor network ecosystem |
Riz Amanuddin, Moon J. Kim, Eric C. Yee |
2017-01-24 |
$6,164,000 |
| 9548350 |
High quality factor capacitors and methods for fabricating high quality factor capacitors |
Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more |
2017-01-17 |
$10,328,000 |
