Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853446 | Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection | Eugene R. Worley, Ratibor Radojcic, Urmi Ray | 2017-12-26 |
| 9847293 | Utilization of backside silicidation to form dual side contacted capacitor | Sinan Goktepeli, Plamen Vassilev Kolev, Michael A. Stuber, Richard Hammond, Steve Fanelli | 2017-12-19 |
| 9799628 | Stacked package configurations and methods of making the same | Dong Wook Kim, Hong Bok We, Jae Sik Lee | 2017-10-24 |
| 9780048 | Side-assembled passive devices | David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more | 2017-10-03 |
| 9773741 | Bondable device including a hydrophilic layer | Yang Du, William Xia | 2017-09-26 |
| 9768109 | Integrated circuits (ICS) on a glass substrate | Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2017-09-19 |
| 9768161 | FinFET capacitor circuit | Rongtian Zhang, Lew G. Chua-Eoan | 2017-09-19 |
| 9704796 | Integrated device comprising a capacitor that includes multiple pins and at least one pin that traverses a plate of the capacitor | Shree Krishna Pandey, Ratibor Radojcic | 2017-07-11 |
| 9633977 | Integrated device comprising flexible connector between integrated circuit (IC) packages | Hong Bok We, Urmi Ray, Ratibor Radojcic | 2017-04-25 |
| 9596768 | Substrate with conductive vias | Hong Bok We, Dong Wook Kim, Jae Sik Lee | 2017-03-14 |
| 9595496 | Integrated device package comprising silicon bridge in an encapsulation layer | Jae Sik Lee, Hong Bok We, Dong Wook Kim | 2017-03-14 |
| 9583460 | Integrated device comprising stacked dies on redistribution layers | Urmi Ray | 2017-02-28 |
| 9577025 | Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device | Ryan David Lane, Glenn D. Raskin, Shree Krishna Pandey | 2017-02-21 |