| 9799628 |
Stacked package configurations and methods of making the same |
Dong Wook Kim, Hong Bok We, Shiqun Gu |
2017-10-24 |
| 9679855 |
Polymer crack stop seal ring structure in wafer level package |
Hong Bok We, Dong Wook Kim, Jon Aday |
2017-06-13 |
| 9675432 |
Method and apparatus for preparing removable dental prosthesis |
Tae Hyung Kim, Sun Young Kwon |
2017-06-13 |
| 9633950 |
Integrated device comprising flexible connector between integrated circuit (IC) packages |
Hong Bok We, Dong Wook Kim |
2017-04-25 |
| 9613942 |
Interposer for a package-on-package structure |
Kyu-Pyung Hwang, Hong Bok We |
2017-04-04 |
| 9596768 |
Substrate with conductive vias |
Hong Bok We, Dong Wook Kim, Shiqun Gu |
2017-03-14 |
| 9595496 |
Integrated device package comprising silicon bridge in an encapsulation layer |
Hong Bok We, Dong Wook Kim, Shiqun Gu |
2017-03-14 |
| 9595494 |
Semiconductor package with high density die to die connection and method of making the same |
Hong Bok We, Dong Wook Kim |
2017-03-14 |
| 9583462 |
Damascene re-distribution layer (RDL) in fan out split die application |
Hong Bok We, Dong Wook Kim |
2017-02-28 |