| 9799628 |
Stacked package configurations and methods of making the same |
Dong Wook Kim, Jae Sik Lee, Shiqun Gu |
2017-10-24 |
| 9679855 |
Polymer crack stop seal ring structure in wafer level package |
Jae Sik Lee, Dong Wook Kim, Jon Aday |
2017-06-13 |
| 9659850 |
Package substrate comprising capacitor, redistribution layer and discrete coaxial connection |
Kyu-Pyung Hwang, Young Kyu Song, Dong Wook Kim |
2017-05-23 |
| 9642259 |
Embedded bridge structure in a substrate |
Chin-Kwan Kim, Omar J. Bchir, Dong Wook Kim |
2017-05-02 |
| 9633950 |
Integrated device comprising flexible connector between integrated circuit (IC) packages |
Jae Sik Lee, Dong Wook Kim |
2017-04-25 |
| 9633977 |
Integrated device comprising flexible connector between integrated circuit (IC) packages |
Shiqun Gu, Urmi Ray, Ratibor Radojcic |
2017-04-25 |
| 9628052 |
Embedded multi-terminal capacitor |
Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song |
2017-04-18 |
| 9613942 |
Interposer for a package-on-package structure |
Jae Sik Lee, Kyu-Pyung Hwang |
2017-04-04 |
| 9596768 |
Substrate with conductive vias |
Dong Wook Kim, Jae Sik Lee, Shiqun Gu |
2017-03-14 |
| 9595496 |
Integrated device package comprising silicon bridge in an encapsulation layer |
Jae Sik Lee, Dong Wook Kim, Shiqun Gu |
2017-03-14 |
| 9595494 |
Semiconductor package with high density die to die connection and method of making the same |
Dong Wook Kim, Jae Sik Lee |
2017-03-14 |
| 9583433 |
Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer |
Young Kyu Song, Kyu-Pyung Hwang |
2017-02-28 |
| 9583462 |
Damascene re-distribution layer (RDL) in fan out split die application |
Jae Sik Lee, Dong Wook Kim |
2017-02-28 |