Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806063 | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability | Chin-Kwan Kim, Rajneesh Kumar, Vladimir Noveski, Jie Fu, Ahmer Syed +1 more | 2017-10-31 |
| 9679841 | Substrate and method of forming the same | Houssam Jomaa, Kuiwon Kang, Chin-Kwan Kim | 2017-06-13 |
| 9642259 | Embedded bridge structure in a substrate | Chin-Kwan Kim, Dong Wook Kim, Hong Bok We | 2017-05-02 |
| 9609751 | Package substrate comprising surface interconnect and cavity comprising electroless fill | Houssam Jomaa, Chin-Kwan Kim | 2017-03-28 |
| 9601435 | Semiconductor package with embedded components and method of making the same | Chin-Kwan Kim, David Fraser Rae, Rajneesh Kumar, Milind Shah | 2017-03-21 |