Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806048 | Planar fan-out wafer level packaging | Lizabeth Keser, Reynante Tamunan Alvarado | 2017-10-31 |
| 9679873 | Low profile integrated circuit (IC) package comprising a plurality of dies | Lizabeth Keser, Piyush Gupta | 2017-06-13 |
| 9601435 | Semiconductor package with embedded components and method of making the same | Chin-Kwan Kim, Rajneesh Kumar, Milind Shah, Omar J. Bchir | 2017-03-21 |
| 9601472 | Package on package (POP) device comprising solder connections between integrated circuit device packages | Lizabeth Keser | 2017-03-21 |