Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9813043 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-11-07 |
| 9807882 | Density-optimized module-level inductor ground structure | Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim | 2017-10-31 |
| 9780048 | Side-assembled passive devices | Changhan Hobie Yun, Chengjie Zuo, Niranjan Sunil Mudakatte, Mario Francisco Velez, Shiqun Gu +1 more | 2017-10-03 |
| 9768109 | Integrated circuits (ICS) on a glass substrate | Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun +1 more | 2017-09-19 |
| 9721946 | Backside coupled symmetric varactor structure | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Jonghae Kim | 2017-08-01 |
| 9666362 | Superposed structure 3D orthogonal through substrate inductor | Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +1 more | 2017-05-30 |
| 9660110 | Varactor device with backside contact | Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun +3 more | 2017-05-23 |
| 9634640 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods | Chengjie Zuo, Daeik Daniel Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez +5 more | 2017-04-25 |
| 9620463 | Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) | Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +1 more | 2017-04-11 |
| 9560745 | Devices and methods to reduce stress in an electronic device | Daeik Daniel Kim, Je-Hsiung Lan, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +1 more | 2017-01-31 |