| 9831172 |
Semiconductor devices having expanded recess for bit line contact |
Jemin Park, Sunghee Han, Yoosang Hwang |
2017-11-28 |
| 9824008 |
Cache memory sharing in a multi-core processor (MCP) |
Karl J. Duvalsaint, Moon J. Kim |
2017-11-21 |
| 9813043 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
Chengjie Zuo, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Hobie Yun +5 more |
2017-11-07 |
| 9806144 |
Solenoid inductor in a substrate |
Young Kyu Song, Xiaonan Zhang, Jonghae Kim |
2017-10-31 |
| 9773862 |
High quality factor capacitors and methods for fabricating high quality factor capacitors |
Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more |
2017-09-26 |
| 9768109 |
Integrated circuits (ICS) on a glass substrate |
Shiqun Gu, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more |
2017-09-19 |
| 9721946 |
Backside coupled symmetric varactor structure |
David Francis Berdy, Je-Hsiung Lan, Changhan Hobie Yun, Jonghae Kim |
2017-08-01 |
| 9692386 |
Three-dimensional wire bond inductor |
Chengjie Zuo, Mario Francisco Velez, Jonghae Kim, Changhan Hobie Yun |
2017-06-27 |
| 9679982 |
Semiconductor device and method of manufacturing the same |
Jiyoung Kim, Jemin Park, Nakjin Son, Yoosang Hwang |
2017-06-13 |
| 9673275 |
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits |
Changhan Hobie Yun, Je-Hsiung Lan, Niranjan Sunil Mudakatte, Jonghae Kim, Matthew Michael Nowak |
2017-06-06 |
| 9666362 |
Superposed structure 3D orthogonal through substrate inductor |
David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +1 more |
2017-05-30 |
| 9660110 |
Varactor device with backside contact |
Jonghae Kim, Chengjie Zuo, Sang-June Park, Changhan Hobie Yun, Mario Francisco Velez +3 more |
2017-05-23 |
| 9634640 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
Chengjie Zuo, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Hobie Yun +5 more |
2017-04-25 |
| 9620463 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) |
David Francis Berdy, Mario Francisco Velez, Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim +1 more |
2017-04-11 |
| 9601607 |
Dual mode transistor |
Xia Li, Bin Yang, Jonghae Kim, Daniel Wayne Perry |
2017-03-21 |
| 9560745 |
Devices and methods to reduce stress in an electronic device |
Je-Hsiung Lan, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +1 more |
2017-01-31 |
| 9548350 |
High quality factor capacitors and methods for fabricating high quality factor capacitors |
Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr. +4 more |
2017-01-17 |
