Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773741 | Bondable device including a hydrophilic layer | Shiqun Gu, William Xia | 2017-09-26 |
| 9754923 | Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Jing Xie, Kambiz Samadi, Pratyush Kamal, Javid Jaffari | 2017-09-05 |
| 9741691 | Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) | Sung Kyu Lim, Kambiz Samadi | 2017-08-22 |
| 9712168 | Process variation power control in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Giby Samson, Yu Pu | 2017-07-18 |
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Sung Kyu Lim, Karamvir CHATHA, Kambiz Samadi | 2017-04-18 |
| 9628077 | Dual power swing pipeline design with separation of combinational and sequential logics | Jing Xie | 2017-04-18 |
| 9583473 | Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology | — | 2017-02-28 |
| 9583179 | Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICs), 3DIC processor cores, and methods | Jing Xie | 2017-02-28 |
| 9578762 | Television monitor combination stand and wall mount | Timothy M. Cassidy, He Kaizuan | 2017-02-21 |
| 9543383 | High-speed high-power semiconductor devices | Vladimir Aparin, Robert P. Gilmore | 2017-01-10 |
| 9536840 | Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods | — | 2017-01-03 |