Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820390 | Process for forming a semiconductor device substrate | Islam A. Salama, Yonggang Li | 2017-11-14 |
| 9741686 | Electronic package and method of connecting a first die to a second die to form an electronic package | Harold Ryan Chase, Mathew J. Manusharow | 2017-08-22 |
| 9711441 | Reduced PTH pad for enabling core routing and substrate layer count reduction | Debendra Mallik | 2017-07-18 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2017-07-11 |
| 9633938 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Daniel N. Sobieski, William J. Lambert | 2017-04-25 |
| 9622350 | Method of forming a circuit board | Mathew J. Manusharow | 2017-04-11 |
| 9552977 | Landside stiffening capacitors to enable ultrathin and other low-Z products | Mathew J. Manusharow | 2017-01-24 |
| 9548264 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2017-01-17 |