Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806011 | Non-uniform substrate stackup | Zhichao Zhang, Zhiguo Qian, Kemal Aygun | 2017-10-31 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2017-07-11 |
| 9607937 | Pin grid interposer | Nicholas R. Watts | 2017-03-28 |
| 9564407 | Crosstalk polarity reversal and cancellation through substrate material | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2017-02-07 |