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CPU package substrates with removable memory mechanical interfaces |
Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more |
2017-11-28 |
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Shielding mold for electric and magnetic EMI mitigation |
Adel A. Elsherbini, Robert L. Sankman, Kemal Aygun |
2017-10-31 |
| 9806011 |
Non-uniform substrate stackup |
Tao Wu, Zhiguo Qian, Kemal Aygun |
2017-10-31 |
| 9775224 |
Discharge apparatus and display panel preparation system based thereon |
Zongjie Guo, Zheng Liu, Xiangqian Ding, Mingxuan Liu |
2017-09-26 |
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Method for manufacturing array substrate, array substrate and display device |
Zheng Liu, Tsung Chieh Kuo, Xi Chen, Xiaoxiang Zhang, Mingxuan Liu |
2017-09-12 |
| 9710089 |
Touch display panel having a plurality of spacers connected to a thin film transistor and manufacturing method thereof |
Xi Chen, Jinchao Bai, Zheng Liu, Xiaoxiang Zhang, Mingxuan Liu |
2017-07-18 |
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Flexible package-to-socket interposer |
Donald T. Tran |
2017-02-14 |
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Crosstalk polarity reversal and cancellation through substrate material |
Tolga Memioglu, Tao Wu, Kemal Aygun |
2017-02-07 |
| 9548734 |
Smart impedance matching for high-speed I/O |
Hongjiang Song, Yan Song, Zhiguo Qian |
2017-01-17 |