Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Bassam N. Coury, Dimitrios Ziakas +11 more | 2017-11-28 |
| 9674954 | Chip package connector assembly | Rajasekaran Swaminathan, Donald T. Tran, Brent Stone | 2017-06-06 |
| 9640887 | Low profile zero/low insertion force package top side flex cable connector architecture | Sanka Ganesan | 2017-05-02 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Sairam Agraharam, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen | 2017-03-21 |