Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more | 2017-11-28 |
| 9793244 | Scalable package architecture and associated techniques and configurations | Bassam M. Ziadeh, Nitesh Nimkar | 2017-10-17 |
| 9721880 | Integrated circuit package structures | Jimin Yao, Shawna M. Liff, Yikang Deng, Debendra Mallik | 2017-08-01 |
| 9660364 | System interconnect for integrated circuits | Timothy Wig, Todd Hinck | 2017-05-23 |
| 9640887 | Low profile zero/low insertion force package top side flex cable connector architecture | Ram Viswanath | 2017-05-02 |
| 9564412 | Shaped and oriented solder joints | Aleksandar Aleksov | 2017-02-07 |