Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842818 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Shawna M. Liff | 2017-12-12 |
| 9721880 | Integrated circuit package structures | Sanka Ganesan, Shawna M. Liff, Yikang Deng, Debendra Mallik | 2017-08-01 |