Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842818 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Jimin Yao | 2017-12-12 |
| 9832863 | Method of fabricating a stretchable computing device | Adel A. Elsherbini, Aleksandar Aleksov | 2017-11-28 |
| 9822470 | Flexible embedded interconnects | Sasikanth Manipatruni, Brian S. Doyle, Vivek Singh | 2017-11-21 |
| 9824901 | Complex cavity formation in molded packaging structures | Sasha N. Oster, Adel A. Elsherbini, Joshua D. Heppner | 2017-11-21 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9721880 | Integrated circuit package structures | Jimin Yao, Sanka Ganesan, Yikang Deng, Debendra Mallik | 2017-08-01 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande | 2017-07-25 |
| 9711284 | Structure to make supercapacitor | Brian S. Doyle, Sasikanth Manipatruni, Vivek Singh | 2017-07-18 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9635764 | Integrated circuit and method that utilize a shape memory material | Shipeng Qiu, Kayleen L. E. Helms, Joshua D. Heppner, Adel A. Elsherbini, Johanna M. Swan +1 more | 2017-04-25 |