| 9842818 |
Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Jimin Yao |
2017-12-12 |
| 9832863 |
Method of fabricating a stretchable computing device |
Adel A. Elsherbini, Aleksandar Aleksov |
2017-11-28 |
| 9822470 |
Flexible embedded interconnects |
Sasikanth Manipatruni, Brian S. Doyle, Vivek Singh |
2017-11-21 |
| 9824901 |
Complex cavity formation in molded packaging structures |
Sasha N. Oster, Adel A. Elsherbini, Joshua D. Heppner |
2017-11-21 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more |
2017-11-14 |
| 9721880 |
Integrated circuit package structures |
Jimin Yao, Sanka Ganesan, Yikang Deng, Debendra Mallik |
2017-08-01 |
| 9716067 |
Integrated circuit package with embedded bridge |
Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande |
2017-07-25 |
| 9711284 |
Structure to make supercapacitor |
Brian S. Doyle, Sasikanth Manipatruni, Vivek Singh |
2017-07-18 |
| 9685388 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Kinya Ichikawa, Nitin A. Deshpande |
2017-06-20 |
| 9635764 |
Integrated circuit and method that utilize a shape memory material |
Shipeng Qiu, Kayleen L. E. Helms, Joshua D. Heppner, Adel A. Elsherbini, Johanna M. Swan +1 more |
2017-04-25 |