| 9847304 |
Electronic device packages with conformal EMI shielding and related methods |
Eric J. Li, Rajendra C. Dias, Mitul Modi |
2017-12-19 |
| 9824901 |
Complex cavity formation in molded packaging structures |
Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff |
2017-11-21 |
| 9795026 |
Electronic package that includes finned vias |
Nayandeep K. Mahanta, Adel A. Elsherbini |
2017-10-17 |
| 9780510 |
Socket contact techniques and configurations |
Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more |
2017-10-03 |
| 9728425 |
Space-efficient underfilling techniques for electronic assemblies |
Serge Louis Roux, Michael J. Baker, Javier A. Falcon |
2017-08-08 |
| 9704811 |
Perforated conductive material for EMI shielding of semiconductor device and components |
Rajendra C. Dias, Mitul Modi, Anna M. Prakash |
2017-07-11 |
| 9685413 |
Semiconductor package having an EMI shielding layer |
Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Ann Jinyan Xu +2 more |
2017-06-20 |
| 9635764 |
Integrated circuit and method that utilize a shape memory material |
Shipeng Qiu, Shawna M. Liff, Kayleen L. E. Helms, Adel A. Elsherbini, Johanna M. Swan +1 more |
2017-04-25 |
| 9615483 |
Techniques and configurations associated with a package load assembly |
Gaurav Chawla, Vijaykumar Krithivasan, Michael Garcia, Kuang Liu, Rajasekaran Swaminathan |
2017-04-04 |
| 9601848 |
Vertical socket contact with flat force response |
Sriram Srinivasan |
2017-03-21 |
| 9603276 |
Electronic assembly that includes a plurality of electronic packages |
David J. Llapitan, Jeffory L. Smalley, Gaurav Chawla, Vijaykumar Krithivasan, Jonathan W. Thibado +2 more |
2017-03-21 |