Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Rajendra C. Dias, Mitul Modi | 2017-12-19 |
| 9824901 | Complex cavity formation in molded packaging structures | Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff | 2017-11-21 |
| 9795026 | Electronic package that includes finned vias | Nayandeep K. Mahanta, Adel A. Elsherbini | 2017-10-17 |
| 9780510 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2017-10-03 |
| 9728425 | Space-efficient underfilling techniques for electronic assemblies | Serge Louis Roux, Michael J. Baker, Javier A. Falcon | 2017-08-08 |
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Rajendra C. Dias, Mitul Modi, Anna M. Prakash | 2017-07-11 |
| 9685413 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Ann Jinyan Xu +2 more | 2017-06-20 |
| 9635764 | Integrated circuit and method that utilize a shape memory material | Shipeng Qiu, Shawna M. Liff, Kayleen L. E. Helms, Adel A. Elsherbini, Johanna M. Swan +1 more | 2017-04-25 |
| 9615483 | Techniques and configurations associated with a package load assembly | Gaurav Chawla, Vijaykumar Krithivasan, Michael Garcia, Kuang Liu, Rajasekaran Swaminathan | 2017-04-04 |
| 9601848 | Vertical socket contact with flat force response | Sriram Srinivasan | 2017-03-21 |
| 9603276 | Electronic assembly that includes a plurality of electronic packages | David J. Llapitan, Jeffory L. Smalley, Gaurav Chawla, Vijaykumar Krithivasan, Jonathan W. Thibado +2 more | 2017-03-21 |