Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Rajendra C. Dias, Joshua D. Heppner, Mitul Modi | 2017-07-11 |
| 9685413 | Semiconductor package having an EMI shielding layer | Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2017-06-20 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | James C. Matayabas, Jr., Arjun Krishnan, Nisha Ananthakrishnan | 2017-04-25 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |