Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Rajendra C. Dias | 2017-12-19 |
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Rajendra C. Dias, Joshua D. Heppner, Anna M. Prakash | 2017-07-11 |